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PRELIMINARY DATA SHEET  
BIPOLAR ANALOG INTEGRATED CIRCUIT  
μPC8158K  
RF UP-CONVERTER WITH AGC FUNCTION + IF QUADRATURE MODULATOR IC  
FOR DIGITAL MOBILE COMMUNICATION SYSTEMS  
DESCRIPTION  
The μPC8158K is a silicon microwave monolithic integrated circuit designed as quadrature mdulor or digital  
mobile communication systems. This MMIC consists of 0.8 GHz to 1.5 GHz up-converter and 100 Mz to 300 MHz  
quadrature modulator which are equipped with AGC and power save functions. This onfigtion suits to IF  
modulation system. The package is 28-pin QFN suitable for high density mounting. The manufactured using  
NEC’s. 20 GHz fT silicon bipolar process NESATTM III to realize low power cumpon. Consequently the  
μPC8158K can contribute to make RF blocks smaller size, higher performance and power consumption.  
FEATURES  
?
?
?
?
?
Supply voltage: VCC = 2.7 to 4.0 V, ICC = 28 mA @ VCC = 3.0 V  
Built-in LPF suppresses spurious multipled by TX local (LO1)  
AGC amplifier is installed in local port of up converter: GCR = 5 dB MIN. @ fout = 1.5 GHz  
Excellent performance: Padj = –65 dBc TYP. @ ?f = ±50 kH= 1.2 % rms TYP.  
External IF filter can be applied between modulator output aconverter input terminal.  
APPLICATIONS  
Digital cellular phones (PDC800M, PDC1.5G and so n)  
?
ORDERING INFORMATION  
Part Number  
Pack
Supplying Form  
μPC8158K-E1  
28-pin pasQFN  
Embossed tape 12 mm wide.  
Pin 1 is in pull-out direction.  
QTY 2.5 kp/Reel.  
(5.1 × 5 × 0.95 mm)  
Remark To orer evaluation samples, please contact your local NEC sales office. (Part number for sample order:  
μPC818K
Caution Electro-static sensitive device  
The information in this document is subject to change without notice.  
Document No. P13831EJ1V1DS00 (1st edition)  
Date Published January 1999 N CP(K)  
Printed in Japan  
?
1998  
μPC8158K  
INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS (TOP View)  
22  
21  
20  
19  
18  
17  
16  
15  
AGCcont  
Up-Mix  
RFout  
N.C.  
23  
24  
25  
14  
13  
LO2b  
LO2in  
AGC  
REG  
V
CC  
GND  
Output Buffer  
MOD + AGC + Up-Mix  
LPF  
V
CC  
REG  
26  
27  
28  
11  
10  
9
Fil1  
Fil2  
QMOD + AGC + Up-Mix  
LO1in  
φ
GND  
I/Q-Mix  
QMOD + AGC + Up-Mix  
LO1inb  
Phase  
Shifter  
1
2
3
4
5
6
7
8
2
Preliminary Data Sheet P13831EJ1V1DS00  
μPC8158K  
QUADRATURE MODULATOR SERIES  
fLO1in  
fMODout  
(MHz)  
Up-Converter Phase  
RFout (MHz) Shifter  
Part Number  
Functions  
ICC (mA)  
Package  
20-pin  
Application  
CT-2, etc.  
(MHz)  
f
μPC8101GR  
μPC8104GR  
150 MHz Quad. Mod  
15/@ 2.7 V 100 to 300  
50 to 150  
External  
F/F  
SSOP (225 mil)  
RF Up-Converter + IF  
Quad. Mod  
28/@ 3.0 V  
100 to 400  
900 to 1 900 Doubler  
+ F/F  
Digital  
Comm.  
μPC8105GR  
μPC8110GR  
μPC8125GR  
400 MHz Quad. Mod  
16/@ 3.0 V  
100 to 400  
External  
16-pin  
SSOP (225 mil)  
1GHz Direct Quad. Mod 24/@ 3.0 V  
800 to 1 000  
220 to 270  
Direct  
20-pin  
PDC80MHz,  
SSOP (225 mil) etc.  
RF Up-Converter + IF  
Quad. Mod + AGC  
36/@ 3.0 V  
35/@ 3.0 V  
1 800 to 2 000  
PHS  
μPC8126GR  
μPC8126K  
900 MHz Direct Quad.  
Mod with Offset-Mixer  
915 to 960  
889 to 960  
915 to 960  
(LO pre-mixer)  
PDC800 MHz  
2QFN  
0-pin  
μPC8129GR  
×2LO IF Quad. Mod +  
28/@ 3.0 V 200 to 800 100 to 400 800 to 1900  
CR  
GSM,  
RF Up-Converter  
SSOP (225 mil) DCS1800, etc.  
μPC8139GR-7JH Transceiver IC  
TX: 32.5  
220 to 270  
100 to 300  
000  
800 to 1 500  
30-pin  
PHS  
(1.9 GHz Indirect Quad. RX: 4.8  
Mod + RX-IF + IF VCO) /@ 3.0 V  
TSSOP  
(225 mil)  
μPC8158K  
RF Up-Converter + IF  
Quad. Mod + AGC  
28/@ 3.0 V  
28-pin QFN  
PDC800 M/  
1.5 G  
For outline of the quadrature modulator series, pleareer to the application note ‘Usage of μPC8101, 8104,  
8105, 8125, 8129’ (Document No. P13251E) and so on
SYSTEM APPLICATION EXAMPLE  
[PDC800 MHz/1.5 GHz]  
SUB ANT  
A  
1st MIX  
2nd MIX  
SW  
MAIN ANT  
To DEMOD  
RSSI OUT  
RSSI  
1st LO  
LO2  
2nd LO  
PLL1  
PLL2  
SW  
SW  
LO1  
AGC  
I
0°  
φ (CR)  
PA  
90°  
Q
PC8158K  
μ
Filter  
3
Preliminary Data Sheet P13831EJ1V1DS00  
μPC8158K  
ABSOLUTE MAXIMUM RATINGS  
Parameter  
Symbol  
VCC  
Conditions  
Rating  
5.0  
Unit  
V
Supply Voltage  
Pin11, 20 and 25,  
TA = +25°C  
Power Save and AGC Control Pin  
Applied Voltage  
VPS/VAGC  
Pin17, TA = +25°C  
5.0  
V
Power Dissipation  
PD  
TA  
T
A = +85°CNote  
430  
mW  
°C  
Operating Ambient Temperature  
Storage Temperature  
–40 to +85  
–55 to +150  
Tstg  
°C  
Note Mounted on double sided copper clad 50 × 50 × 1.6 mm epoxy glass PWB.  
RECOMMENDED OPERATING CONDITIONS  
Parameter  
Symbol  
VCC  
Test Conditions  
Pin11, 20 and 25  
MIN.  
2
0
.  
MAX.  
Unit  
V
Supply Voltage  
3.0  
4.0  
0.3  
Power Save Voltage  
VPS  
Pin17  
Pin17  
V
AGC Control Voltage  
VAGCPS  
TA  
1.0  
–30  
800  
600  
DC  
2.5  
V
Operating Ambient Temperature  
Up-converter RF Output Frequency  
LO2 Input Frequency  
+25  
+80  
1500  
1750  
10  
°C  
fRFout  
fLO2in  
fI/Qin  
MHz  
MHz  
MHz  
PLO2in = –Bm  
I/Q Input Frequency  
VI/Qin = 00 mVP-P MAX.  
(ferenl input)  
LO1 Input Level  
PLO1in  
PLin  
VI/Qin  
–18  
–18  
–15  
–15  
420  
–12  
–12  
500  
300  
dBm  
dBm  
mVP-P  
MHz  
LO2 Input Level  
I/Q Input Amplitude  
I, Ib, Q, Qb each  
PLO1in = –15 dBm  
Up-converter Input Frequency  
Modulator Output Frequency  
LO1 Input Frequency  
fUPCONin  
fMODout  
fLO1in  
100  
4
Preliminary Data Sheet P13831EJ1V1DS00  
μPC8158K  
ELECTRICAL CHARACTERISTICS  
Conditions (Unless otherwise specified):  
TA = +25 °C, VCC1 = VCC2 = VCC3 = 3.0 V, VPS/VAGC = 2.5 V,  
I/Q (DC) = Ib/Qb (DC) = VCC/2 = 1.5 V, VI/Ibin = VQ/Qbin = 500 mVP-P (each), fI/Qin = 2.625 kHz,  
π/4DQPSK wave input, transmission rate 42 kbps, filter roll-off α = 0.5,  
Modulation Pattern: <0000>  
fLO1in = 178.05 MHz, PLO1in = –15 dBm  
fLO2in = 1619.05 MHz, PLO2in = –15 dBm  
fRFout = 1441 MHz – fI/Qin  
Parameter  
Symbol  
Test Conditions  
MIN.  
TYP.  
MX.  
Unit  
UP-CONVERTER + QUADRATURE MODULATOR TOTAL  
Total Circuit Current  
ICC (TOTAL)  
No input signal  
23.7  
8  
37.6  
10  
mA  
VPS 0.5 V (Low),  
Total Circuit Current at Power Save Mode  
ICC (PS) TOTAL  
.3  
μA  
No input signal  
Total Output Power 1  
PRFout1  
PRFout2  
LOL  
VAGC = 2.5 V  
VAGC = 1.0 V  
fLOL = fLO1 + fLO2  
–11.5  
–52  
–40  
–40  
–50  
40  
–8  
–46.5  
–30  
–30  
–30  
dBm  
dBm  
dBc  
dBc  
dBc  
dB  
Total Output Power 2  
–56.5  
LO Carrier Leak  
Image Rejection (Side Band Leak)  
I/Q 3rd order distortion  
AGC Gain Control Range  
Error Vector Magnitude  
Adjacent channel interference  
ImR  
IM3 (I/Q)  
GCR  
EVM  
Padj  
V2 V 1 V  
35  
MD Ptern: PN9  
1.2  
3.0  
%rms  
dBc  
= ±50 kHz,  
–65  
–60  
MOD Pattern: PN9  
Spurious suppression  
Power Save Rise Time  
Power Save Fall Time  
I/Q input impedance  
I/Q input bias current  
LO1 input VSWR  
P(8fLO)  
TPS ise)  
TPS (Fall)  
ZI/Q  
fLO1 × 8, fLO1 × 8 (image)Note  
–70  
2
–65  
5
dBc  
μs  
μs  
k?  
μA  
VPS (Low) VPS (High)  
VPS (High) VPS (Low)  
2
5
Between pin I/Ib, Q/Qb  
Between pin I/Ib, Q/Qb  
fLO1 = 100 M to 300 MHz  
80  
200  
5
II/Q  
13  
ZLO1  
1.5:1  
Note Without extrnal LC between Fil1 and Fil2 pin on this frequency conditions.  
Sptrum analyzer conditions: VBW = 300 Hz, RBW = 300 Hz.  
k Electrical characteristics in this document is described for 1.5 GHz system.  
5
Preliminary Data Sheet P13831EJ1V1DS00  
μPC8158K  
PIN EXPLANATIONS  
Pin  
Supply  
Pin  
Voltage  
(V)Note  
Symbol  
Voltage  
(V)  
Function and Application  
Internal Equivalent Circuit  
No.  
1
Iin  
VCC/2  
Input for I signal. This input  
impedance is 200 k?. In the case of  
that I/Q input signals are single  
ended, amplitude of the signal is  
500 m VP-P max.  
2
Iinb  
VCC/2  
Input for I signal. This input  
impedance is 200 k?. In the case of  
that I/Q input signals are single  
ended, VCC/2 biased DC signal  
should be input. In the case of the  
I/Q input signals are differential,  
amplitude of the signal is 500 m VP-P  
max.  
1
2
3
4
N.C.  
Qinb  
This pin is not connected to internal  
circuit. This pin should be opened  
or grounded.  
––––––––––––––––  
VCC/2  
Input for Q signal. This input  
impedance is 200 k?. In the case of  
that I/Q input signals are single  
ended, amplitude of the signal is  
500 m VP-P max.  
5
Qin  
VCC/2  
Input for I signal. This inpt  
impedance is 200 k?In the ase of  
that I/Q input sigs are igle  
ended, VCC/2 sed C signal  
should be put. n case of the I/Q  
input nals e differential,  
amplitude of the signal is 500 m VP-P  
max.  
4
5
6
7
8
9
N.C.  
N.C.  
Thse pins are not connected to  
ternal circuit. These pins should  
be opened or grounded.  
–––––––––––––––––  
N.C.  
LO1inb  
28  
2.98  
Bypass pin of modulator’s local  
input. This pin should be decoupled  
with 330 pF capacitor.  
9
10  
10  
11  
Local signal input for modulator.  
This pin must be coupled with DC  
cut capacitor 330 pF and should be  
terminated with 51 ? resistor.  
VCC  
2.7 to 4.0  
Supply voltage pin for modulator,  
up-converter and AGC circuits.  
–––––––––––––––––  
Note Pin Voltages are measured on VCC = 3.0 V.  
6
Preliminary Data Sheet P13831EJ1V1DS00  
μPC8158K  
Pin  
Supply  
Voltage  
(V)  
Pin  
No.  
Voltage  
(V)Note  
Symbol  
GND  
Function and Application  
Internal Equivalent Circuit  
12  
0
Ground pin for modulator, up-  
converter and AGC circuits. This pin  
should be grounded with minimum  
inductance. Form the ground  
pattern as widely as possible to  
minimize ground impedance.  
–––––––––––––––––  
13  
14  
LO2in  
1.8  
1.8  
Local signal input for modulator.  
This pin must be coupled with DC  
cut capacitor 33 pF and should be  
terminated with 51 ? resistor.  
13  
14  
LO2inb  
Bypass pin of up-converter’s local  
signal input. This pin should be  
decoupled with 33 pF capacitor.  
15  
16  
N.C.  
0
This pin is not connected to internal  
circuit. This pin should be opened  
or grounded.  
–––––––––––––  
–––––––––––––––––  
GND  
Ground pin for modulator, up-  
converter and AGC circuits. This pin  
should be grounded with minum  
inductance.  
17  
VPS/VAGC  
VPS/VAGC  
Power save control pin for  
modulator, up-conved AGC  
circuits. This pin also siged as  
gain control pin for GC circuits.  
Operation statwitapplied  
voltageare as follows.  
REG  
17  
VPS/VC (V)  
0 o 0.4  
STATE  
AGC Cont  
OFF (Sleep Mode)  
On (AGC Mode)  
1 to 2.5  
18  
19  
N.C.  
0
This pin is not connected to internal  
circuit. This pin should be opened  
or grounded.  
–––––––––––––––––  
GND  
Ground pin for modulator, up-  
converter and AGC circuits. This pin  
should be grounded with minimum  
inductance.  
–––––––––––––––––  
21  
VCC  
2.7 to 4.0  
0
Supply voltage pin for modulator,  
up-converter and AGC circuits.  
–––––––––––––––––  
–––––––––––––––––  
GND  
Ground pin for RF output buffer.  
This pin should be grounded with  
minimum inductance.  
Note Pin Voltages are measured on VCC = 3.0 V.  
7
Preliminary Data Sheet P13831EJ1V1DS00  
μPC8158K  
Pin  
Supply  
Voltage  
(V)  
Pin  
No.  
Voltage  
(V)Note  
Symbol  
N.C.  
Function and Application  
Internal Equivalent Circuit  
22  
This pin is not connected to internal  
circuit. This pin should be opened  
or grounded.  
–––––––––––––––––  
23  
RFout  
1.75  
RF output pin. This pin is emitter  
follower which is low impedance  
output port. This pin can be easily  
matched to 50 ? impedance using  
external coupling and decoupling  
capacitors.  
External  
23  
24  
25  
N.C.  
VCC  
These pins are not connected to  
internal circuit. These pins should  
be opened or grounded.  
–––––––––––––––  
–––––––––––  
2.7 to 4.0  
Supply voltage pin for RF output  
buffer.  
26  
27  
Fil1  
Fil2  
2.76  
2.76  
External inductor and capacitor can  
supress harmonics spurious of LO1  
frequency.  
rnal  
26  
27  
LC value should be determined  
according to LO1 input frequency  
and suppression level.  
28  
GND  
0
Ground pin for modutor, up-  
converter and AC circuits. This pin  
shoube grunded with minimum  
inductane. Fom the ground  
ptteas widely as possible to  
inimizground impedance.  
–––––––––––––––––  
Note Pin Voltages are mean VCC = 3.0 V.  
8
Preliminary Data Sheet P13831EJ1V1DS00  
μPC8158K  
TEST CIRCUIT  
Voltage  
Source  
Voltage Source or  
Pulse Pattern Generator  
μ
Vector Signal  
Analyzer or Spectrum  
Analyzer  
22 21 20 19 18  
17 16 15  
Signal Generator  
Voltage  
Source  
AGCcont  
51 ?  
33 pF  
2 pF  
RFout  
23  
μ
UP-CON  
LO2b 14  
LO2in13  
BPF  
51  
?
33 pF  
24  
Voltage  
Source  
AGC  
LPF  
V
CC  
GND  
25  
12  
REG  
REG  
μ
Fil1  
Fil2  
V
CC  
26  
27  
11  
BPF  
I/Q Mixer  
330 pF  
LO1in10  
LO1b  
Phase  
Shifter  
28 GND  
9
gnal Generator  
or Network  
330 p
Analyzer  
1
2
3
4
5
6
7
8
100 pF  
100 pF  
100 pF  
100 pF  
I/Q Signal  
Generar  
TEST CONDITIONS  
fLO1in = 178.05 MHz, PLO1in = –15 dm  
fLO2in = 1619.05 MHz, PLO2in = –dBm  
fRFout = 1441 MHz – fI/Qin  
9
Preliminary Data Sheet P13831EJ1V1DS00  
μPC8158K  
PACKAGE DIMENSIONS  
28 pin plastic QFN (UNIT: mm)  
4 – 0.5  
Pin 28  
Pin 1  
0.22  
0.5  
7 × 0.5 = 3.5  
5.5 ± 0.1  
(5.5 ± 0.1)  
(5.1)  
(0.22)  
(4.5)  
0.5  
0.5  
Bottom View  
10  
Preliminary Data Sheet P13831EJ1V1DS00  
μPC8158K  
RECOMMENDED SOLDERING CONDITIONS  
This product should be soldered under the following recommended conditions. For soldering methods and  
conditions other than those recommended below, contact your NEC sales representative.  
μPC8158K  
Recommended Condition  
Soldering Method  
Infrared Reflow  
Soldering Conditions  
Symbol  
Package peak temperature: 235°C or below  
Time: 30 seconds or less (at 210°C)  
Count: 2, Exposure limitNote: None  
IR35-02  
Partial Heating  
Pin temperature: 300°C  
Time: 3 seconds or less (per side of device)  
Exposure limitNote: None  
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for talloble storage period.  
Caution Do not use different soldering methods together (except for rtial heating).  
For details of recommended soldering conditions for surface ounting, refer to information document  
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C1055E).  
11  
Preliminary Data Sheet P13831EJ1V1DS00  
μPC8158K  
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.  
No part of this document may be copied or reproduced in any form or by any means without the prior written  
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in  
this document.  
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property  
oduct  
rights of third parties by or arising from use of a device described herein or any other liability arising from use  
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other  
intellectual property rights of NEC Corporation or others.  
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,  
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or  
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety  
measures in its design, such as redundancy, fire-containment, and anti-failure features.  
NEC devices are classified into the following three quality grades:  
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a  
customer designated "quality assurance program" for a specific application. The recommended applications of  
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device  
ued Pr  
before using it in a particular application.  
Standard: Computers, office equipment, communications equipment, test and measurement equipment,  
audio and visual equipment, home electronic appliances, machine tools, personal electronic  
equipment and industrial robots  
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems or medical equipment for life support, etc.  
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.  
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,  
they should contact an NEC sales representative in advance.  
Anti-radioactive design is not implemented in this product.  
M4 96. 5  
Discontin