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LM358

Rev.J Oct.-2018

DATA SHEET

描述 / Descriptions

SOP-8 塑封封裝雙通道放大器。Dual Operational Amplifiers in a SOP-8 Plastic Package.

特征 / Features

內(nèi)部單位增益頻率補(bǔ)償，有較大的直流電壓增益：100dB，工作電壓范圍寬（V_CC=3V~36V），輸入共

模電壓范圍接近地電平，輸出電壓范圍大：從 0~Vcc-1.5V，適用于電池工作時(shí)的電力消耗。

Internally frequency compensated for unity gain, Large DC voltage gain : 100dB, Wide operating

supply range (V_cc=3V~36V),Input common mode voltage includes ground, Large output voltage swing:

From 0 to Vcc-1.5V,Power drain suitable for battery operation.

用途 / Applications

適用于傳感器放大器，直流增益模塊和所有傳統(tǒng)的運(yùn)算放大器電路。

Application areas include transducer amplifier, DC gain blocks and all the conventional OP amp

circuits.

內(nèi)部等效電路 / Equivalent Circuit

引腳排列 / Pinning

8

7

6

5

1

2

3

4

PIN 見(jiàn)內(nèi)部等效電路 /PIN See Equivalent Circuit.

印章代碼 / Marking

見(jiàn)印章說(shuō)明 / See Marking Instructions

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LM358

Rev.J Oct.-2018

DATA SHEET

極限參數(shù) / Absolute Maximum Ratings(Ta=25℃)

參數(shù)

Parameter

符號(hào)

Symbol

V_CC

數(shù)值

Rating

?18

單位

Unit

V

Supply Voltage

Differential input voltage

Input Voltage

V_I(DIFF)

V_I

36

V

-0.3~36

570

Power Dissipation

P_d

mW

℃

T_opr

Operating Temperature

Storage Temperature

0 ~ 70

-65 ~ 150

T_stg

℃

電性能參數(shù) / Electrical Characteristics(Ta=25℃)

參數(shù)

符號(hào)

測(cè)試條件

最小值典型值最大值單位

Parameter

Symbol

Test Conditions

Min

Typ

Max

Unit

V_CM=0 to Vcc-1.5

2.0

3.0

mV

Input offset voltage

V_IO

V_o(p)=1.4V

R_s=0

2.0

45

30

nA

Input offset current

Input Bias current

I_IO

I_b

100

Input Commonmode

voltage range

V

V_I(R)

I_cc

V_cc=30V

0

V_CC-1.5

2.0

1.2

mA

R_L=∞

V_cc=30V

0.8

0.5

Supply Current

V_cc=5V

V_cc=15V

V_o(p)=1V to 11V

R_L>2k?

25

Large signal Voltage Gain

G_V

100

V/mV

26

27

V_cc=30V

V_cc=5V

R_L=2k?

V

V_(OH)

Output voltage Swing

R_L=10k?

28

5

V_(OL)

20

mV

Commonmode

rejection Ratio

65

CMRR

75

dB

Power supply rejection Ratio

Chanel Sepparation

PSRR

CS

100

5

dB

mV

mA

f=1kHz to 20kHz

20

60

Short circuit to GND

I_sc

40

V_I(+)=1V

V_cc=15V

V_I(-)=0

20

10

12

I_source

40

13

45

mA

V_o(p)=2V

V_I(-)=1V

V_o(p)=2V

V_I(-)=0

V

_I(+)=0V

Output current

V_cc=15V

V_I(+)=1V

V_cc=15V V_o(p)=200mV

I_sink

μA

Differential input voltage

V_I(diff)

V_cc

V

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LM358

Rev.J Oct.-2018

DATA SHEET

原理框圖 / Functional Block Diagram

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LM358

Rev.J Oct.-2018

DATA SHEET

電參數(shù)曲線圖 / Electrical Characteristic Curve

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LM358

Rev.J Oct.-2018

DATA SHEET

電參數(shù)曲線圖 / Electrical Characteristic Curve

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LM358

Rev.J Oct.-2018

DATA SHEET

外形尺寸圖 / Package Dimensions

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LM358

Rev.J Oct.-2018

DATA SHEET

印章說(shuō)明 / Marking Instructions

BR

LM358

****

說(shuō)明：

BR：

為公司代碼

為型號(hào)代碼

LM358：

****：

Note:

為生產(chǎn)批號(hào)代碼，隨生產(chǎn)批號(hào)變化

BR:

LM358:

****:

Company Code.

Product Type.

Lot No. Code, code change with Lot No.

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LM358

Rev.J Oct.-2018

DATA SHEET

回流焊溫度曲線圖(無(wú)鉛) / Temperature Profile for IR Reflow Soldering(Pb-Free)

說(shuō)明：

Note:

1、預(yù)熱溫度 150～180℃，時(shí)間 60～90sec;

2、峰值溫度 245±5℃，時(shí)間持續(xù)為 5±0.5sec;

3、焊接制程冷卻速度為 2～10℃/sec.

1.Preheating:150~180℃, Time:60~90sec.

2.Peak Temp.:245±5℃, Duration:5±0.5sec.

3. Cooling Speed: 2~10℃/sec.

耐焊接熱試驗(yàn)條件 / Resistance to Soldering Heat Test Conditions

溫度：260±5℃

時(shí)間：10±1 sec.

Temp.:260±5℃

Time:10±1 sec

包裝規(guī)格 / Packaging SPEC.

卷盤(pán)包裝 / REEL

Package Type

Units 包裝數(shù)量

Dimension 包裝尺寸 (unit：mm³)

Units/Reel

Reels/Inner Box

Units/Inner Box

Inner Boxes/Outer Box

Units/Outer Box

封裝形式

Reel

13〞×12

Inner Box 盒

Outer Box 箱

只/卷盤(pán)

卷盤(pán)/盒

只/盒

盒/箱

只/箱

SOP/ESOP-8

4,000

2

8,000

6

48,000

360×360×50

380×335×366

使用說(shuō)明 / Notices

http://www.fsbrec.com

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